3D-Mikro-Components beyond Ultra-Precision Engineering
Konferenz: Mikrosystemtechnik Kongress 2005 - Mikrosystemtechnik Kongress 2005
10.10.2005 - 12.10.2005 in Munich, Germany
Tagungsband: Mikrosystemtechnik Kongress 2005
Seiten: 4Sprache: EnglischTyp: PDF
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Autoren:
Detemple, Peter; Schmitt, Stefan; Haase, Frank; Doll, Theodor (Institut für Mikrotechnik Mainz GmbH, Carl-Zeiss-Str. 18-20, 55129 Mainz, Germany)
Inhalt:
Advanced silicon micromachining allows the realization of micro structured parts that exhibit structural dimensions and tolerances far beyond the abilities of ultra-precision engineering. In particular in combination with methods of thin film technology they are a versatile tool for the manufacturing of customer-specific sensors, micro components and subsystems for various fields of application. Using silicon structures as a master for the realization of metal mold inserts the fabrication of micro components from plastics becomes feasible.