PSM-X2: Polysilicon surface micromachining process platform for vacuum-packaged sensors

Konferenz: Mikrosystemtechnik Kongress 2005 - Mikrosystemtechnik Kongress 2005
10.10.2005 - 12.10.2005 in Munich, Germany

Tagungsband: Mikrosystemtechnik Kongress 2005

Seiten: 4Sprache: EnglischTyp: PDF

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Merz, P.; Reinert, W.; Reimer, K.; Wagner, B. (Fraunhofer Institute for Silicon Technoloy ISIT, Fraunhoferstr. 1, 25524 Itzehoe, Germany)

At Fraunhofer ISIT the poly silicon surface micromachining process PSM-X2 for the production of vibrating micro electromechanical systems (MEMS) such as gyrometers or accelerometers is established. This process combines broad geometry flexibility of the MEMS structure together with a high operational pressure bandwidth. Competitive benefits are the use of a wafer-level packaging process with superior packing density and the integration of a high capacity getter film for low vauum levels and secured device lifetime. Since Inertial Measurement Units (IMU) require different sensor designs and concepts this process platform is uniquely suited for their common production.