Microneedle Arrays Replicated Using Vacuum Casting and Hot Embossing
Konferenz: Mikrosystemtechnik Kongress 2005 - Mikrosystemtechnik Kongress 2005
10.10.2005 - 12.10.2005 in Munich, Germany
Tagungsband: Mikrosystemtechnik Kongress 2005
Seiten: 4Sprache: EnglischTyp: PDF
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Autoren:
Trautmann, A.; Heuck, F.; Ruther, P.; Paul, O. (IMTEK, Microsystem Materials Laboratory, University of Freiburg, 79110 Freiburg, Germany)
Mueller, C. (IMTEK, Process Technology, University of Freiburg, 79110 Freiburg, Germany)
Inhalt:
A replication route for high-aspect-ratio silicon microstructures into polymers is described. A master wafer is replicated into a silicone mold which is then transferred accurately into SU-8, epoxy, cycloolefine copolymer, and polycarbonate. The method is demonstrated with silicon microneedle arrays with 841 needles on an area of 36 mm2. Structures with heights between 75 and 150 µm and curvature radii below 2 µm are excellently reproduced. In addition, the fabrication of microneedles on a polymer grid and the combination of the replicated structures with through-holes is demonstrated.