Silicon Microneedle Formation Using Modified Mask Designs Based on Convex Corner Undercut

Konferenz: Mikrosystemtechnik Kongress 2005 - Mikrosystemtechnik Kongress 2005
10.10.2005 - 12.10.2005 in Munich, Germany

Tagungsband: Mikrosystemtechnik Kongress 2005

Seiten: 4Sprache: EnglischTyp: PDF

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Wilke, N.; Hoffmann, D.; Monissey, A. (Tyndall National Institute, Lee Maltings, Prospect Row, Cork, Ireland)

In this work we present the mechanism of silicon convex corner undercutting for modified etch masks in aqueous KOH solution (29 % KOH, 79deg C) during rnicroneedle fabrication. Modified mask designs include three different shapes as well as different compensation structures employed to a square mask shape. We have found that square mask-shapes present an optimum structure in contrast to circular or diamond shapes. The use of compensation structures facilitates an increase in needle density of 33 % to 40 %.