Packaged Multidimensional Stress Sensing – Towards the Smart Orthodontic Bracket

Konferenz: Mikrosystemtechnik Kongress 2005 - Mikrosystemtechnik Kongress 2005
10.10.2005 - 12.10.2005 in Munich, Germany

Tagungsband: Mikrosystemtechnik Kongress 2005

Seiten: 4Sprache: EnglischTyp: PDF

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Bartholomeyczik, J.; Haefner, J.; Joos, J.; Schubert, F.; Ruther, P.; Paul, O. (IMTEK – Microsystem Materials Laboratory, University of Freiburg, 79110 Freiburg, Germany)
Lapatki, B. (Abteilung Poliklinik für Kieferorthopädie, Universität Freiburg, 79106 Freiburg i. Br., Germany)

This paper reports a novel sensor concept to measure the six components of the forces and torques applied to smart orthodontic brackets. The concept is demonstrated using a packaged CMOS based sensor chip and a novel test setup to measure the six forces and moments applied to a smart bracket. By measuring the stresses in the plane of a sensor chip inside the bracket, it is possible to extract the forces and moments externally applied to the bracket. The sensor chip contains three CMOS piezoresistive stress sensors making it possible to separate one force and two moments with the range typical for orthodontic therapy.