Martin, C.; Ménager, L.; Allard, B. (Centre de Génie Electrique de Lyon, Bâtiment Léonard de Vinci, 20 avenue Albert Einstein, 69100 VILLEURBANNE, France)
Guichon, J. M.; Schanen, J. L. (Laboratoire d’Electrotechnique de Grenoble, ENSIEG – BP 46 – 38402 Saint Martin d’Hères Cedex, France)
Integration of power systems will require new packaging technologies. The compactness of new structure developed is a new challenge in the converter design. New packaging technologies are investigated in order to satisfy this volume constraint. Die location and interconnect currently used nowadays avoid the design of 3D structure for power electronic systems. This paper will present several techniques and discussion will be lead. According that thermal and mechanical requirements ensure satisfying reliability, special attention will be paid on the interconnect design.