Failure Mechanisms in SiC Power Module Interconnects
Konferenz: CIPS 2006 - 4th International Conference on Integrated Power Systems
07.06.2006 - 09.06.2006 in Naples, Italy
Tagungsband: CIPS 2006
Seiten: 6Sprache: EnglischTyp: PDF
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Autoren:
McCluskey, F. P.; Meyyappan, K.; Hansen, P. (CALCE Electronic Products and Systems Center, University of Maryland, College Park, MD)
Inhalt:
Solid-state power modules are subjected to harsh environmental and operational loads. Identifying the potential weak-links and dominant failure mechanisms is very critical to designing reliable power modules. This paper presents the PoF (Physics of Failure) based approach to determine the stresses/strains and the damage arising due to the thermo-mechanical loads in some of the critical failure sites identified in typical power modules.