Thermo-mechanical Stress Analysis for Planar Metallization in Integrated Power Electronics Modules
Konferenz: CIPS 2006 - 4th International Conference on Integrated Power Systems
07.06.2006 - 09.06.2006 in Naples, Italy
Tagungsband: CIPS 2006
Seiten: 6Sprache: EnglischTyp: PDF
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Autoren:
Zhu, N.; Wyk, J. D. van; Liang, Z. X. (NSF Engineering Research Center for Power Electronics Systems (CPES), The Bradley Department of Electrical and Computer Engineering, Virginia Polytechnic Institute and State University, Blacksburg, Virginia 24061-0179, USA)
Inhalt:
Power switching devices, passive power components and EMI filters can all been integrated into planar power modules by utilizing planar integration technology. Planar metallization on brittle substrates is the major feature of integrated power electronics modules. Mechanical properties of interfaces between deposited metal traces and substrates are critical for reliable operation. This paper investigates the values of thermo-mechanical stresses in simplified structures by theoretical calculation and Finite Element Modeling (FEM) simulation. In-plane stress and peel stress are addressed as the failure indicators for delamination and cracks respectively.