Technology for an improved class of integrated electromagnetic passive modules
Konferenz: CIPS 2006 - 4th International Conference on Integrated Power Systems
07.06.2006 - 09.06.2006 in Naples, Italy
Tagungsband: CIPS 2006
Seiten: 6Sprache: EnglischTyp: PDF
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Autoren:
Liu, Wenduo; Wyk, J. D. van (Center for Power Electronics Systems, Virginia Polytechnic Institute and State University, Blacksburg, USA)
Inhalt:
Integrated passives have been applied in power electronics field with the development of electromagnetic inte-gration technologies. With the developed design approaches, the proposed integrated module can be built with appropriate processing technologies. This paper takes an integrated LLCT module as the example to illustrate the implementation of integrated passives. The constructional considerations, applied materials and processing technologies are detailed. The test results of a prototype are compared with the design expectations.