An improved low profile integratable LTCC power inductor for microprocessor power delivery applications
Konferenz: CIPS 2006 - 4th International Conference on Integrated Power Systems
07.06.2006 - 09.06.2006 in Naples, Italy
Tagungsband: CIPS 2006
Seiten: 6Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Lim, Michele H.; Liang, Zhenxian; Wyk, J. Daan van (National Science Foundation Engineering Research Center for Power Electronics Systems, The Bradley Department of Electrical and Computer Engineering, Virginia Polytechnic Institute and State University, Blacksburg, VA 24061, USA)
This paper presents an improved design of a low profile power inductor suitable for planar integration, fabricated based on low temperature co-fired ceramics (LTCC) technology for microprocessor power delivery applications. The LTCC inductor was tested on a prototype Buck converter, operating at a switching frequency of 4MHz, input voltage of 5V, duty cycle of 20% and carrying a full load nominal DC current of 12.5A. The use of the LTCC inductor demonstrates an overall reduction in power consumption under no load condition by more than half. When operating at full load, the overall efficiency is improved by 2.4-3.6%, when compared with the state-of-the-art inductor. This paper outlines the design procedure, followed by impedance measurement results and large signal measurement results, and comparison is made with state-of-the-art surface mount power inductor.