System-in-Package: From Discrete Components to Highly Integrated Devices and Modules
Konferenz: VDE-Kongress 2006 - Innovations for Europe - Fachtagungsberichte der ITG/BMBF - GMM - ETG - GMA - DGBMT
23.10.2006 - 25.10.2006 in Aachen, Germany
Tagungsband: VDE-Kongress 2006
Seiten: 6Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Faber, Werner (EPCOS AG, Munich, Germany)
The very dynamic wireless communication market demands steady miniaturization together with dramatically increased functionality and improved performance, e.g., for PDAs, cellular phones, and notebooks. It is necessary to clear space for additional functionalities. Consequent monolithic integration like system on chip (SoC) solutions is limited and is often too expensive. Therefore, other strategies are necessary. System in package (SiP) integration technology provides a solution, that meets the requirements of customers and market. SiP is more than an assembly of components. The strength of SiP is the chance to combine many passive and active devices using best technologies to achieve best system performance. Advanced integration, connection, and packaging technologies allow miniaturization of the fully functional system and/or subsystem. In this respect EPCOS possesses the necessary fundamental core competence and mature key technologies. The surface acoustic wave (SAW) and bulk acoustic wave (BAW) filters of EPCOS are key components for the RF front-end of cellular phones. Our low temperature co-fired ceramic (LTCC) is used as integration substrate. EPCOS benefits from relevant experience of 3-dimensional RF design for SAW and BAW devices. Based on its unique connection and packaging technology EPCOS is world market leader for acoustic devices. This is an ideal precondition for success in modules and SiP technologies.