Challenges of residual layer minimisation in thermal nanoimprint lithography

Konferenz: EMLC 2007 - 23rd European Mask and Lithography Conference
22.01.2007 - 26.01.2007 in Grenoble, France

Tagungsband: EMLC 2007

Seiten: 6Sprache: EnglischTyp: PDF

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Bogdanski, Nicolas; Wissen, Matthias; Möllenbeck, Saskia; Scheer, Hella-Christin (University of Wuppertal, Rainer-Gruenter-Str 21, D-42119 Wuppertal, Germany)

When minimal residual layers are aimed at in the field of thermal imprint lithography (T-NIL) 'partial cavity filling' offers a promising method to succeed. There, a filling of any of the cavities a stamp provides is avoided by a reduction of the initial layer thickness. Due to this unusual procedure, some challenges evolve during the imprint of complex types of structures. We report about effects that go along with partial cavity filling like physical self assembly and recovery. Furthermore we will give some suggestions how they may be reduced or even can be avoided.