Contact-free Component Assembly – A New Approach in Microsystem Packaging
Konferenz: MikroSystemTechnik - KONGRESS 2007
15.10.2007 - 17.10.2007 in Dresden, Germany
Tagungsband: MikroSystemTechnik
Seiten: 5Sprache: EnglischTyp: PDF
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Autoren:
Becker, K.-F.; Fiedler, S.; Bauer, J.; Kolesnik, I. (Fraunhofer Institut Zuverlässigkeit und Mikrointegration, Gustav-Meyer-Allee 25, 13355 Berlin)
Mollath, G.; Schreck, G. (Fraunhofer Institut Produktionsanlagen und Konstruktionstechnik, Pascalstr. 8-9, 10587 Berlin)
Reichl, H. (Technische Universität Berlin, Technologien der Mikroperipherik, Gustav-Meyer-Allee 25, 13355 Berlin)
Inhalt:
The adaptation of self organization principles to meet the specific requirements of future microelectronic packaging and thus assembly of single micro- and submicron-components into functional units and systems can be regarded as a fundamentally new approach in microelectronic technologies. The motivation for this new development, to integrate fundamentally new nano-components into microelectronic systems will be given. First examples of known successful application of contact-free assembly principles for microelectronic functionality of nanoscaled components will be presented based on an overview of fundamental principles. Related work in progress at Fraunhofer IZM will be presented.