Plasma printing – a new technique for the cost-efficient manufacture of flexible printed circuits
Konferenz: MikroSystemTechnik - KONGRESS 2007
15.10.2007 - 17.10.2007 in Dresden, Germany
Seiten: 3Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Borris, Jochen; Thomas, Michael; Zänker, Antje; Klages, Claus-Peter (Fraunhofer Institute for Surface Engineering and Thin Films IST, Bienroder Weg 54 E, 38108 Braunschweig, Germany)
Möbius, Andreas; Elbick, Danica (Enthone GmbH, Elisabeth-Selbert-Straße 4, 40764 Langenfeld, Germany)
Weidlich, Ernst-Rudolf (GRT GmbH & Co. KG, Runtestrase 28, 59457 Werl, Germany)
A new potentially cost-efficient technology combining patterned atmospheric pressure dielectric barrier discharge (DBD) treatment, here referred to as plasma printing, and galvanic plating for the production of flexible printed circuits (FPC) is presented in this contribution. The technology is being jointly developed by partners from industry and academia, a major aim being the realization of the processes in a reel-to-reel production system. So far, plasma printing experiments have been carried out using lab-scale batch plants. Using suitable electroless plating baths, RFID tag and interdigital structures with line widths and spaces down to 200 µm could already be produced. Adhesion of copper on DBD treated polyimide foil reached up to about 1 N/mm, as was determined in a peel test similar to that described in the DIN 53494.