MEMS Characterization Technique Based on Special Designed Test-Structures

Konferenz: MikroSystemTechnik - KONGRESS 2007
15.10.2007 - 17.10.2007 in Dresden, Germany

Tagungsband: MikroSystemTechnik

Seiten: 4Sprache: EnglischTyp: PDF

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Autoren:
Shaporin, Alexey; Forke, Roman; Doetzel, Wolfram; Mehner, Jan (Chemnitz University of Technology, Germany)

Inhalt:
The paper presents an advanced technique for monitoring of MEMS manufacturing that is based on teststructures. It utilizes a data fusion process that combines numerically calculated and experimentally determined data to estimate geometrical and material properties. A proof of the concept based on first examples of teststructures is shown. This advanced technique is capable to characterize typical technological impacts on geometry and material property, like mask-undercut, sidewall-angles and mechanical stress. It enables efficient in-situ and non-destructive MEMS manufacturing monitoring on wafer level.