Micro- and Nano-NDE for future Microelectronic Packaging

Inhalt:
The challenge of next generation packaging requires new non-destructive evaluation (NDE) techniques to detect and characterize very small defects like Kirkendall voids or micro cracks. Imaging technologies with resolutions in the sub-micron range are desired. Possible evaluation methods are for example x-ray microscopy, x-ray tomography, ultrasonic microscopy and thermal microscopy. However, techniques with this resolution can not be found on the market. The Center for Non-Destructive Nano Evaluation (nanoeva(R)) is launched to develop this equipment jointly with the electronics industry and to transfer the knowledge to colleagues in industry and research institutions. The new center is a common organization of Fraunhofer IZFP Dresden branch (IZFP-D) and the Centre of Microtechnical Manufacturing (ZmuP) of the Technische Universität Dresden.