Laser Scattering Technique for Characterizing Defects and Surface Morphology in the Fixed Abrasive CMP Process

Konferenz: ICPT 2007 - International Conference on Planarization / CMP Technology
25.10.2007 - 27.10.2007 in Dresden, Germany

Tagungsband: ICPT 2007

Seiten: 5Sprache: EnglischTyp: PDF

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Mahajan, Uday; Zhang, Haiping; Douglas, Carlotte (KLA-Tencor Corporation, Milpitas, CA 95035, USA)
Gagliardi, John; Olson, Erik (3M Corporation, St. Paul, MN 55144, USA)

In this study, laser scattering technology was evaluated for defectivity and surface characterization of a Fixed Abrasive (FA) CMP process. Light Point Defect (LPD) and micro-haze measurements from a KLA-Tencor Surfscan SP2 were used to characterize the performance of different FA CMP process conditions, and the results were compared against a conventional High Selectivity Slurry (HSS) process. The results show that laser scattering is an effective methodology for obtaining full-wafer defect and surface condition information at high throughput.