Laser Scattering Technique for Characterizing Defects and Surface Morphology in the Fixed Abrasive CMP Process

Inhalt:
In this study, laser scattering technology was evaluated for defectivity and surface characterization of a Fixed Abrasive (FA) CMP process. Light Point Defect (LPD) and micro-haze measurements from a KLA-Tencor Surfscan SP2 were used to characterize the performance of different FA CMP process conditions, and the results were compared against a conventional High Selectivity Slurry (HSS) process. The results show that laser scattering is an effective methodology for obtaining full-wafer defect and surface condition information at high throughput.