Conditioning of CMP Pad to Reinstate Pad Surface Functions
Konferenz: ICPT 2007 - International Conference on Planarization / CMP Technology
25.10.2007 - 27.10.2007 in Dresden, Germany
Tagungsband: ICPT 2007
Seiten: 5Sprache: EnglischTyp: PDF
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Autoren:
Kadomura, Kazunori (A.L.M.T. DIAMOND Corp.,1816-174, Kotaka-Kuroishi, Kato-shi, Hyogo 679-0221, JAPAN)
Fukunishi, Toshio (A.L.M.T. Corp.,1816-174, Kotaka-Kuroishi, Kato-shi, Hyogo 679-0221, JAPAN)
Umezaki, Yoji; Matsukawa, Yoji; Kurokawa, Syuhei; Doi, Toshiro K. (Kyushu University, 744, Motooka, Nishi-ku, Fukuoka 819-0395, JAPAN)
Inhalt:
The role of the pad conditioning using two types of diamond pad conditioners in the CMP (chemical mechanical polishing) process has been investigated from the relationship between the pad surface conditions and polishing properties. During oxide-CMP, pad surface becomes clogged with the chips that are chemical reaction materials, causing the pad surfaces to degrade. Diamond conditioning serves to reinstate the pad surface providing it with necessary asperities.