Point of Use Quality Control of CMP Slurries

Konferenz: ICPT 2007 - International Conference on Planarization / CMP Technology
25.10.2007 - 27.10.2007 in Dresden, Germany

Tagungsband: ICPT 2007

Seiten: 6Sprache: EnglischTyp: PDF

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Hinze, Frank; Altmann, Justus (Aello – BU of GWT-TUD GmbH, Chemnitzer Str. 48b, D-01187 Dresden, Germany)

The CMP slurry quality is often treated as given constant. Experiences of slurry preparation, quality variations, slurry aging, plant parts wear-out in slurry supply systems etc. are very poor. The question stands: What happen in centralised supply systems? Results of in-line measurements with different devices are presented for commonly used Alumina and Ceria slurries. Issues of accuracy, reproducibility and detection of drifts are discussed. Effects of slurry handling, blending, plant parameters were studied. Significant changes of slurry behaviour were found in different applications. Finally experiences using this technique for process monitoring will be discussed.