Advanced Adhesives based on Carbon Nanotube Technology

Konferenz: Smart Systems Integration 2008 - 2nd European Conference & Exhibition on Integration Issues of Miniaturized Systems - MOMS, MOEMS, ICS and Electronic Components
09.04.2008 - 10.04.2008 in Barcelona, Spain

Tagungsband: Smart Systems Integration 2008

Seiten: 4Sprache: EnglischTyp: PDF

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Fecht, Hans-Jörg (Institute of Micro and Nanomaterials, Ulm University, Ulm)
Leson, Andreas (Fraunhofer Institut für Werkstoff- und Strahltechnik, Dresden, Germany)
Michel, Bernd (Fraunhofer Institut für Zuverlässigkeit und Mikrointegration, Department Micro Materials Center, Berlin, Germany)
Werner, Matthias (NMTC – Nano & Micro Technology Consulting, Berlin, Germany)

For microsystems packaging and system integration new processing techniques are being developed on the basis of advanced composites using nanoscale building blocks - here carbon nanotubes - incorporated in relevant interconnect materials, such as metallic solders and highly conductive polymer based adhesives.