Hybrid Chip-Scale Integration of Inertial MEMS by Chip-to-Wafer Vacuum Bonding
Konferenz: Smart Systems Integration 2008 - 2nd European Conference & Exhibition on Integration Issues of Miniaturized Systems - MOMS, MOEMS, ICS and Electronic Components
09.04.2008 - 10.04.2008 in Barcelona, Spain
Tagungsband: Smart Systems Integration 2008
Seiten: 8Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Marenco, Norman; Reinert, Wolfgang (Fraunhofer Institut für Siliziumtechnologie, Itzehoe, Germany)
Kostner, Hannes; Hill, Gerhard (Datacon Technology GmbH, Radfeld, Austria)
Inertial microsensors require precisely controlled ambient pressure conditions to adjust the damping of moving structures in resonant or damped operation mode. Waferlevel packaging allows even vacuum sealing for pressures down to 0,1 mbar in nanoliter cavities. Today, waferbonding of passive caps on microsensors is most established. - A direct interconnect between MEMS and ASIC would have certain advantages in terms of cost, size, noise suppression and system design. The two possible approaches are Wafer-to-Wafer (W2W) and Chip-to-Wafer (C2W), both being investigated in the European DAVID project. A status of this work after two years with focus on the C2W-related bonding technology is presented in this paper.