From the flexible / rigid-flexible circuit board solution to the mechatronic 3D unit
Konferenz: Smart Systems Integration 2008 - 2nd European Conference & Exhibition on Integration Issues of Miniaturized Systems - MOMS, MOEMS, ICS and Electronic Components
09.04.2008 - 10.04.2008 in Barcelona, Spain
Tagungsband: Smart Systems Integration 2008
Seiten: 4Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Bäcker, Dirk (LPKF Laser & Electronics AG, Garbsen, Deutschland)
Often the use of flexible and rigid-flexible circuit boards is owed to the necessity to transfer currents and voltages to the second, third or n'th level to ensure a save signal transfer. The use is often hindered by the significantly higher price (compared to conventional methods like cable connector). This is due to various but comprehensible causes. On the one hand, on the world market the price for the used materials has drastically risen during the last years. On the other hand, the production of this special shape of circuit board, although by now mostly state of the art of the technology, is very much more sensitive as far as process control is concerned and it requires the compliance to a number of design and production rules.