Analysis of Thermomechanical Stress in Bare Die Assemblies on Polymer Substrates
Konferenz: Smart Systems Integration 2008 - 2nd European Conference & Exhibition on Integration Issues of Miniaturized Systems - MOMS, MOEMS, ICS and Electronic Components
09.04.2008 - 10.04.2008 in Barcelona, Spain
Tagungsband: Smart Systems Integration 2008
Seiten: 3Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Majcherek, Soeren; Leneke, Thomas; Hirsch, Soeren; Schmidt, Bertram (IMOS-TEPROSA – Otto-von-Guericke University of Magdeburg, P.O. Box 4120, 39016 Magdeburg, Germany)
This paper reports on a method for the measurement of packaging induced thermomechanical stress. The thermomechanical influence on MEMS sensor and actuator structures which were assembled on substrates made of new polymers for the 3D molded interconnect device (3D-MID) technology was researched. Finite element analysis was used to calculate the stress profile with different packaging materials and different packaging geometries. Afterwards, experimental tests were done to validate the simulation results.