Minimizing the impact of fabrication tolerance on embedded filters
Konferenz: Smart Systems Integration 2008 - 2nd European Conference & Exhibition on Integration Issues of Miniaturized Systems - MOMS, MOEMS, ICS and Electronic Components
09.04.2008 - 10.04.2008 in Barcelona, Spain
Tagungsband: Smart Systems Integration 2008
Seiten: 3Sprache: EnglischTyp: PDF
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Autoren:
Fotheringham, Gerhard; Maaß, Uwe; Ndip, Ivan (Dept. System Design and Integration, Fraunhofer IZM, Berlin, Germany)
Reichl, Herbert (Fak. IV, TU Berlin, Berlin, Germany)
Inhalt:
The choice of packaging technology is determined by diverse factors such as electrical performance, reliability, cost and package size. Embedded components are one of the solutions for increased system miniaturization. Their feasibility depends both on the electrical performance as weil as on fabrication tolerance of the technology. This contribution focuses on the impact of fabrication tolerance on the electrical characteristics of embedded filters and compares different technologies.