Thermo-Mechanical Modelling of Chip to Wafer Hermetic Vacuum Bonding Process

Konferenz: Smart Systems Integration 2008 - 2nd European Conference & Exhibition on Integration Issues of Miniaturized Systems - MOMS, MOEMS, ICS and Electronic Components
09.04.2008 - 10.04.2008 in Barcelona, Spain

Tagungsband: Smart Systems Integration 2008

Seiten: 3Sprache: EnglischTyp: PDF

Persönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt

Malecki, Krzysztof; Friedel, Kazimierz (Wroclaw University of Technology, Poland)
Bock, Gernot; Hillmann, Gerhard (Datacon Technology AG, Radfeld, Austria)

A nowadays market demands for advanced MEMS encourages producers to extensive research aimed at improvement of production yield and at increase a devices reliability. In the case of vacuum MEMS that employ getter technology for vacuum enhancement, and increased production yield, the development of anew individual process flow is very complex. In particular, the adaptation of the equipment for packaging process becomes a grate challenge where computer-aided development and virtual modelling appears tremendously helpful. The implementation of new approach for a Chip to Wafer (C2W) bonding is one of main goals of the European project DAVID realised in frame of EU-FP6. In this paper Authors report the implementation of a Finite Element Method (FEM) in modelling the heat flow and deformation of bonding machine main parts in order to improve the technology for hermetic vacuum bonding and in particular to develop the bonding machine itself.