Thin substrate handling by electrostatic force
Konferenz: Smart Systems Integration 2008 - 2nd European Conference & Exhibition on Integration Issues of Miniaturized Systems - MOMS, MOEMS, ICS and Electronic Components
09.04.2008 - 10.04.2008 in Barcelona, Spain
Tagungsband: Smart Systems Integration 2008
Seiten: 4Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Wieland, Robert; Bock, Karlheinz; Hacker, Erwin; Landesberger, Christof; Ramm, Peter (Fraunhofer IZM, Munich branch of the Institute, Munich, Germany)
Efficient handling and processing of thinned Si-substrates becomes increasingly important for such technologies like 3D system integration, MEMS applications and advanced packaging and micro integration. Using suitable adhesives to bond device wafers temporarily to a rigid handling wafer can offer an efficient solution for 3D IC fabrication – if the material is satisfying a set of stringent requirements. In the future this may be replaced or at least supplemented by a novel handling technique that uses mobile electrostatic carrier ("mobile e-Chuck"), fabricated by processing a standard Si-wafer. The corresponding principle is based on electrostatic forces between the e-Chuck wafer, serving as a mobile handling substrate, and the thin device wafer or chips. The mobile e-Chuck is fully CMOS-compatible and it allows long duration times for electrostatic holding also after disconnecting a charging unit.