Application of Nucleate Boiling with Micro Structured Surfaces for Electronic Cooling

Konferenz: PCIM Europe 2014 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
20.05.2014 - 22.05.2014 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2014

Seiten: 8Sprache: EnglischTyp: PDF

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Autoren:
Schubert, Andreas; Zinecker, Mike; Hackert-Oschaetzchen, Matthias (Technische Universitaet Chemnitz, Reichenhainer Str. 70, 09126 Chemnitz, Germany)
Lausberg, Martin (cool tec Electronic GmbH, Ilmenauer Str. 4, 98701 Großbreitenbach, Germany)
Schulz, Andreas (Strukturtechnik UG, Neuer Weg 22-23, 06484 Quedlinburg, Germany)

Inhalt:
In this study a cooling technology based on a two-phase-change of a working fluid is presented. By help of special micro structured heat transfer surfaces, the boiling rates increase compared to unstructured surfaces. Large amounts of heat up to several kilowatts can be removed by intense boiling of the working fluid, also with small surface areas. For the generation of appropriate micro structures, different micro manufacturing technologies can be applied, demonstrated in this paper. The presented results of systematic experiments show the capability of this cooling technology for power and high-power electronics.