Over-Temperature protection for IGBT modules

Konferenz: PCIM Europe 2014 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
20.05.2014 - 22.05.2014 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2014

Seiten: 7Sprache: EnglischTyp: PDF

Persönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt

Autoren:
Wang, Ke; Song, Gaosheng; Ma, Xiankui (Mitsubishi Electric & Electronics (Shanghai) Co., Ltd., China)
Liao, Yongjun (Shenzhen Inovance Technology Co., Ltd., China)

Inhalt:
This paper will summarize the approaches and applications of temperature sensor for IGBT modules, including direct measurement of mounting a sensor on the chip and the NTC inside IGBT modules. Additionally, the calculation methods of the maximum junction temperature Tjmax for low output frequencies are introduced. This paper will also show how to design temperature sensing circuit and set over-temperature protection for Mitsubishi CM450DX-24S1.