Silicone Protection Solution for IGBT Modules: from Dielectric Encapsulation to Thermal Management
Konferenz: PCIM Asia 2015 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
24.06.2015 - 26.06.2015 in Shanghai, China
Tagungsband: PCIM Asia 2015
Seiten: 5Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Li, Zhiliang; Zhou, Hua; Xiao, Kevin; Yang, Bruce; Li, Winter (Wacker Chemicals, Hongmei Road, Shanghai, China)
Rouse, Jason (Wacker Chemicals, Sutton Road, Adrian, USA)
This paper introduces a family of silicone materials designed for use in IGBT modules to provide dielectric insulation and thermal management to meet the demanding needs of the power electronics market.1 To meet the dielectric insulation requirements and the increasing higher temperature stability needs, WACKER has developed gels with ultra-purity levels of <2 ppm total residual ions combined with >200deg C thermal stability, in particular, SEMICOSIL(r) 915 HT and SEMICOSIL(r) 920LT. A unique feature of SEMICOSIL(r) 915HT is that it can also be cured with a UV-activated catalyst that allows for very short processing time even at room-temperature. In the area of thermal management, WACKER has recently launched SEMICOSIL(r) 975TC adhesive to augment the thermally conductive Paste P12 in cooling IGBTs to allow them to work more reliably and efficiently.