The High Power Density and High Efficiency 7th Generation IGBT Module Realizing Compact Power Conversion Systems
Konferenz: PCIM Asia 2015 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
24.06.2015 - 26.06.2015 in Shanghai, China
Tagungsband: PCIM Asia 2015
Seiten: 9Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Li, J.; Chen, S. (Fuji Electric China Co., Ltd., China)
Kawabata, J.; Kusunoki, Y.; Onozawa, Y.; Nishimura, Y.; Kobayashi, Y.; Ikawa, O. (Fuji Electric Co., Ltd., 4-18-1 Tsukama Matsumoto Nagano, Japan)
Recently the main requirements found in the market are further downsizing and higher efficiency of power conversion systems. Enhanced power density of the power modules will be the key to succeed. The increasing package reliability in higher junction temperature operation will be the major challenge. By further improvement of the chip characteristics and the development of new high reliability package materials and technologies, the performance of the modules were significantly improved. Additionally, the maximum operating temperature was even increased to up to 175deg C. The new 7th generation IGBT module realized further downsizing and higher efficiency of power conversion systems.