Double Sided Cooled Module concept for High Power Density in HEV Applications

Konferenz: PCIM Europe 2015 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
19.05.2015 - 20.05.2015 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2015

Seiten: 7Sprache: EnglischTyp: PDF

Persönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt

Autoren:
Grassmann, Andreas; Geitner, Ottmar; Hable, Wolfram; Neugirg, Christian; Schwarz, Alexander; Winter, Frank; Yoo, Inpil (Infineon Technologies AG, 93049 Regensburg, Germany)

Inhalt:
Electric Vehicles (EV) and Hybrid Electric Vehicles (HEV) are expected to be produced and commercialized at a large scale in the coming years. This requires the integration of an electric drive train into a large number of car platforms under massive space and cost constraints. We present a novel power module concept with double sided chip cooling which allows very high power densities. In addition, lower stray inductance and package resistance improvements enable high inverter efficiencies.