Integration Technologies for a Fully Modular and Hot-Swappable MV Multi-Level Concept Converter

Konferenz: PCIM Europe 2015 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
19.05.2015 - 20.05.2015 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2015

Seiten: 8Sprache: EnglischTyp: PDF

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Autoren:
Cottet, Didier; Merwe, Wim van der; Agostini, Francesco; Riedel, Gernot; Oikonomou, Nikolaos; Rueetschi, Andrea; Geyer, Tobias; Gradinger, Thomas; Velthuis, Rudi; Wunsch, Bernhard; Baumann, David; Gerig, Willi; Wildner, Franz; Sundaramoorthy, Vinoth; Bianda, Enea; Zurfluh, Franz; Bloch, Richard; Angelosante, Daniele; Dzung, Dacfey (ABB Switzerland Ltd., Corporate Research, 5405 Baden-Dättwil, Switzerland)
Wien, Tormod; Vallestad, Anne Elisabeth; Orfanus, Dalimir; Indergaard, Reidar; Vefling, Harald; Heggelund, Arne (ABB Norway Ltd., Corporate Research, 1375 Billingstad, Norway)
Bradshaw, Jonathan (DPS Ltd., Auckland 1010, New Zealand)

Inhalt:
In order to fully exploit the benefits of modular converters, dedicated hard- and software integration technologies have been developed to complement modular multi-level circuit topologies. The technologies investigated include a wireless auxiliary power supply, a two-phase cooling, solid insulation, wireless optical communication, redundant EtherCAT networking and advanced IGBT junction temperature diagnostics. Emphasis was set on three key aspects of modularity: scalability, configurability and pluggability. To validate the technologies and to demonstrate their benefits, a medium voltage concept converter was built and operated. The combination of these technologies finally also enabled a ‘hot swap’ functionality, where power modules can be replaced during converter operation. Hot swap has successfully been tested for a DC-link voltage of 3.3 kV and output power of 550 kW.