Integrated Liquid Cooling Automotive IGBT Module for High Temperatures Coolant Application

Konferenz: PCIM Europe 2015 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
19.05.2015 - 20.05.2015 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2015

Seiten: 7Sprache: EnglischTyp: PDF

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Autoren:
Wang, Yangang; Dai, Xiaoping; Liu, Guoyou; Wu, Yibo; Li, Daohui; Jones, Steve (Power Semiconductor R&D Centre, Dynex Semiconductor Ltd, CSR Times Electric Co. Ltd,, UK)

Inhalt:
By eliminating the thermal grease layer in mounting, the direct liquid cooling IGBT module has substantial thermal resistance reduction and is highly attractive to automotive industry. In this work, an IGBT module cooperates with thin Cu, Al and Al in-line fins base plate is developed for Hybrid and Electric Vehicles (HEV/EV). The weight and cost are saved by keeping the merits of low thermal resistance and high reliability. Thermal simulation shows that the power switches work at the safe temperature envelop during the highest transient and continuous power output stages of a passenger car with sharing 105?C cooling of the engine. The lifetime is predicted under a real mission that shows the module is capable of meeting the requirements with high coolant temperature.