Active power cycling results using copper tin TLPB joints as new die-attach technology
Konferenz: PCIM Europe 2015 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
19.05.2015 - 20.05.2015 in Nürnberg, Deutschland
Tagungsband: PCIM Europe 2015
Seiten: 8Sprache: EnglischTyp: PDF
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Autoren:
Ehrhardt, Christian; Lang, Klaus Dieter (Technische Universität Berlin, Germany)
Hutter, Matthias; Weber, Constanze (Fraunhofer IZM, Germany)
Inhalt:
A new highly reliable die-attach technology for high operating temperature is called Transient Liquid Phase Bonding (TLPB). The TLPB is based on phase transformation into intermetallic phases using a low melting solder layer and a high melting bonding surface. Due to this fact the re-melting temperature of such a transformed joint increased up to the decomposition temperature of the intermetallic phase, which might be more the 200 K of the used soldering temperature. In active power cycling analysis between +30 °C and 180 °C (DeltaT = 150 K) the TLPB showed more than 100-times longer lifetime compared to eutectic SnAg-solder. Furthermore, other failure mechanisms were found compared to Sn-based solder joints such as fatigue cracks in the copper layers of the DCB-substrate and the chip interface as well as delamination between the Al2O3-layer and the bottom Cu-layer of the DCB.