Thermal Optimization within Power Packages for Automotive Applications

Inhalt:
Thermal optimization within a power package is an endless quest to achieve lower operating temperature. This paper first investigates the correlation between various package features and their time intervals of maximum influence on the thermal impedance (Zth). It then analyses the cooling efficiency of a few optimized structures in typical automotive applications, such as short-circuit, filament lamp inrush and motor inrush. This method should be used for any future assessment of new cooling methods.