3D electro-thermal simulation of multilayer power MOSFET structure under electro-thermal stress
Konferenz: PCIM Europe 2015 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
19.05.2015 - 20.05.2015 in Nürnberg, Deutschland
Tagungsband: PCIM Europe 2015
Seiten: 6Sprache: EnglischTyp: PDF
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Autoren:
Bazzano, Gaetano; Cavallaro, Daniela Grazia; Greco, Rosario; Raffa, Alessandra; Veneziano, Pier Paolo (STMicroelectronics, Italy)
Inhalt:
In this work a 3D electro-thermal-mechanical simulation by a Finite Element Model (FEM) using COMSOL Multiphysics is used to investigate the robustness of a multilayer power MOSFET structure under electro-thermal stress. Thermal, stress and strain maps obtained by simulation help to identify the critical layers and to evaluate the reliability of the power component.