A 1700V-IGBT module and IPM with new insulated metal baseplate (IMB) featuring enhanced isolation properties and thermal conductivity

Konferenz: PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
10.05.2016 - 12.05.2016 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2016

Seiten: 6Sprache: EnglischTyp: PDF

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Takahashi, Takuya; Kimura, Yoshitaka; Ishibashi, Hidetoshi; Yoshida, Hiroshi; Otsubo, Yoshitaka (Power Device Works, Mitsubishi Electric Corp., Japan)

An enhanced module insulating technology IMB (Insulated Metal Baseplate) that features a high thermal conductivity and insulation properties and its application to IGBT module and IPM are presented. New IMB improves the thermal conductivity of the insulating resin layer by approximately 50% compared to the conventional IMB by optimization of powder particle and resin material. Thickness optimization realizes the best balance of heat resistance and insulation capabilities. This is the first IMB solution for 1700V module which requires high heat dissipation and insulation. It is also fitted for IPM application. We have successfully confirmed new IMB’s heat resistance and insulation capabilities suitable for these applications.