New High Power Density Modules for EV/HEV Applications
Konferenz: PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
10.05.2016 - 12.05.2016 in Nürnberg, Deutschland
Tagungsband: PCIM Europe 2016
Seiten: 6Sprache: EnglischTyp: PDF
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Autoren:
Inokuchi, Seiichiro; Saito, Shoji; Izuka, Arata; Hata, Yuki; Hatae, Shinji (Mitsubishi Electric Co., Japan)
Hussein, Khalid (Mitsubishi Electric Europe B.V., Germany)
Inhalt:
This paper addresses a newly developed IGBT module dedicated for large Electric Vehicle (EV) and Hybrid Electric Vehicle (HEV) power-train inverter applications. The new IGBT module family adopts a 6-in-1 circuit configuration in one package, optimized internal wiring layout, Direct Lead Bond (DLB) structure and direct cooling structure with an integrated water-cooled Al fin. As a result, this new IGBT module family has simultaneously achieved high performance, low self-inductance, compact package and light weight. Compared to conventional products with similar power capabilities, the adoption of these innovative technologies has led to an improved thermal performance of 20%, and has reduced the module’s self-inductance by 30%, the footprint by 50% and the weight by 70%.