Improvement of system level power density of 15A/600V intelligent power modules
Konferenz: PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
10.05.2016 - 12.05.2016 in Nürnberg, Deutschland
Tagungsband: PCIM Europe 2016
Seiten: 5Sprache: EnglischTyp: PDF
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Autoren:
Harper, Jonathan (ON Semiconductor GmbH, Zamdorferstr, 100, 81677 Munich, Germany)
Inhalt:
A novel approach to implementing a 15A/600V intelligent power module using a new type of DBC substrate is presented. The module is 40% smaller than other intelligent power modules having a similar current and voltage specification which use IMS, lead frames or other combinations of substrates in their construction. Despite the reduction in size, the thermal resistance of the package is 5% lower. Careful optimization of the IGBT and diode reduces the overall power losses by 5%.