Low-stress silicone encapsulant for reliable power conversion devices
Konferenz: PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
10.05.2016 - 12.05.2016 in Nürnberg, Deutschland
Tagungsband: PCIM Europe 2016
Seiten: 4Sprache: EnglischTyp: PDF
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Autoren:
Beaucarne, Guy; Vanlathem, Eric (Dow Corning Europe S.A., Rue Jules Bordet, Parc Industriel Zone C, 7180 Seneffe, Belgium)
Zou, Lu (Dow Corning(China) Holding Co.Ltd, Zhangjiang Hi-Tech Park, Pudong District, Shanghai 201203, China)
Larson, Kent (Dow Corning Corporation, 2200 W Salzburg Rd, Midland, MI, USA)
Inhalt:
The emergence of distributed energy production and vehicle electrification has created the need for power conversion devices that remain highly reliable even when exposed to outdoor climatic conditions for decades. We describe a new encapsulant that contributes to reaching this kind of reliability. It is a tacky and soft silicone material that applies minimal stress on electronic components during thermal cycling and shows thermal conductivity to evacuate heat, while enabling fast assembly thanks to low viscosity and high cure speed. Material properties are described and compared to those of conventional power device encapsulants. Device testing is also reported, including stress measurement in encapsulated devices.