Reliability of Double Side Silver Sintered Devices with various Substrate Metallization
Konferenz: PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
10.05.2016 - 12.05.2016 in Nürnberg, Deutschland
Tagungsband: PCIM Europe 2016
Seiten: 8Sprache: EnglischTyp: PDF
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Autoren:
Henaff, Francois Le (Alpha Assembly Solutions, Elisabeth-Selbert-Str. 4, 40764 Langenfeld, Germany)
Greca, Gustavo; Salerno, Paul; Khaselev, Oscar; Boureghda, Monnir; Durham, Jeffrey; Lifton, Anna (Alpha Assembly Solutions, 109 Corporate Boulevard South Plainfield NJ 0890, USA)
Mathieu, Olivier; Reger, Martin (Rogers Germany GmbH, Am Stadtwald 2, 92676 Eschenbach, Germany)
Harel, Jean Claude; Laud, Satyavrat (Renesas Electronics America (REA), 2801 Scott Blvd, Santa Clara, CA 95050, USA)
He, Weikun; Sarkany, Zoltan; Proulx, Joe; Parry, John (Mentor Graphics, 81 Bridge Road, East Molesey, KT8 9HH, UK)
Inhalt:
Silver sintering technology is one of the most promising high performance lead-free die-attach technologies. The work presented focuses on the thermo-mechanical and electrical performance evaluation of double side sintered modules. Die and clip attachments are processed with pressure assisted Argomax(r) silver sintering technology developed by Α Assembly Solutions. Power cycling tests following automotive requirements (200A, 5s ON and 10s OFF, until failure) and thermal cycling tests (liquid to liquid, -55deg C/+165deg C, 3 minutes dwell time for 1000 cycles) were applied to the devices. Thermal impedance measurements along with optical observations (metallographic and CSAM analysis) showed a significant increase of the 650V/200A IGBT device reliability when compared with best in class solder technology.