Investigation of the Influence of Ageing Processes on Thermal Characteristics of an IGBT Power Module by Means of Transient Thermal Analysis
Konferenz: PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
10.05.2016 - 12.05.2016 in Nürnberg, Deutschland
Tagungsband: PCIM Europe 2016
Seiten: 5Sprache: EnglischTyp: PDF
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Autoren:
Essen, Tobias von; Ras, Mohamad Abo (Berliner Nanotest und Design GmbH, Germany)
Stegmeier, Stefan; Mitic, Gerhard (Siemens AG, Germany)
Inhalt:
Power electronics demand high reliability and lifetime to prevent high costs and downtimes due to unplanned maintenance. This paper uses a transient thermal FE simulation to analyze the thermal behavior of an IGBT power converter module. Different failure modes are in the focus of investigation: die attach constriction, wire bond lift-off and solder as well as thermal grease degradation. The simulation is optimized with the help of thermal impedance measurements of a device in power cycling. With the help of FE simulation different failure modes are possible to identify in the structure function. Extended use of these results is presented.