Thermal Evaluation of a 200A NPC2 Module used in a 3-level Inverter up to 60 kW
Konferenz: PCIM Asia 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
28.06.2016 - 30.06.2016 in Shanghai, China
Tagungsband: PCIM Asia 2016
Seiten: 6Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Ma, Sichao (Infineon Technologies China Co., Shanghai, China)
A method of thermal measurement with a thermocouple is introduced to access the temperature of different chips inside an EasyPACK module with NPC2 or T-type three-level topology. This is widely used in the domain of power supply application such as PV string inverter, active power filter (APF) and uninterruptable power supply (UPS). Based on power losses calculation according to PV string inverter up to 60kW, dedicated chips inside the module are powered up with an external DC-source. Meanwhile, chip temperature is observed referring to an inverter providing active and reactive power including Low Voltage Ride-Through conditions. In addition, one of chip temperatures is monitored and correlated to the NTC’s temperature during high voltage load test.