A New 600V Smart power Module with the High Power Density for Motor Drive Applications in Home Appliances
Konferenz: PCIM Asia 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
28.06.2016 - 30.06.2016 in Shanghai, China
Tagungsband: PCIM Asia 2016
Seiten: 8Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Shin, Samuell; Jin, Bumseung; Song, Kinam; Bae, Hyunsoo; Kwon, Taesung (Fairchild Semiconductor, South Korea)
This paper presents a new 600V SPM(r) 55 package with transfer molded type, which combines with the features of the latest trench field-stop technology (FST) IGBT and optimized gate driver IC to achieve the excellent solution for motor drives applications in home appliances. Especially, this module is adopted and optimized to integrated bootstrap circuitry in drive IC which can be fully supported for a simple layout and less PCB space to develop a motor drive power stage. This paper describes an overall description of the new SPM device as well as the package structure, thermal performance and electrical characteristics of the IGBT with bootstrap circuitry.