New Transfer Mold type SLIMDIP with RC-IGBT and high precision Short Circuit protection function
Konferenz: PCIM Asia 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
28.06.2016 - 30.06.2016 in Shanghai, China
Tagungsband: PCIM Asia 2016
Seiten: 7Sprache: EnglischTyp: PDFPersönliche VDE-Mitglieder erhalten auf diesen Artikel 10% Rabatt
Wang, Yazhe; Shibata, Shogo (Mitsubishi Electric Corporation, Power Device Works, 1-1-1 Imajukuhigashi Nishi-Ku Fukuoka City 819-0192, Japan)
A new transfer mold type SLIM package DIPIPM(exp TM) (SLIMDIP) developed for small capacity motor drive system in home appliance applications like air-conditioner, washing machine, refrigerator, fan drive etc. that compact size and high reliability are pursued is presented in this paper. The new SLIMDIP is utilizing thin wafer Reverse Conducting IGBT (RC-IGBT) based on the 7th generation CSTBT(exp TM) technology to integrate Free Wheeling Diode (FWD) and IGBT function into a single chip for reducing power chip counts from twelve to six and achieved a more compact package size 30% smaller than Mitsubishi super-mini series DIPIPM(exp TM) products. The module is manufactured by transfer-mold technology that is capable to provide superior matching of mechanical expansion coefficient especially between copper leadframe and the molding material which is contributed to higher reliability.