Novel Automotive Hybrid-IGBT-Module without Solder Technology
Konferenz: PCIM Asia 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
28.06.2016 - 30.06.2016 in Shanghai, China
Tagungsband: PCIM Asia 2016
Seiten: 8Sprache: EnglischTyp: PDF
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Autoren:
Pluschke, Norbert (SEMIKRON (Hong Kong) Co. Ltd., Hong Kong)
Inhalt:
A new Hybrid-IGBT module optimized for the requirements of automotive applications will be introduced. Since many years ago, SEMIRKON has the SKiM 63/93-family in the product portfolio. The SKiM module was designed for automotive application. The target in the design of this module was the extension of the lifetime by some special changes. Chips are not soldered anymore, power contacts by pressure technology, auxiliary contacts by spring technology and the internal mechanical design was optimized of “low inductance” module design. IGBT driver PCB can be connected without cable. Spring technology is used.