Taking Power Semiconductors to the Next Level:Novel Plug & Play High Thermal Performance Insulated Molded Power Package

Konferenz: PCIM Europe 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
16.05.2017 - 18.05.2017 in Nürnberg, Deutschland

Tagungsband: PCIM Europe 2017

Seiten: 5Sprache: EnglischTyp: PDF

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Autoren:
Kasztelan, Christian; Basler, Thomas; Mengel, Manfred; Fuergut, Edward (Infineon Technologies AG, Germany)

Inhalt:
Infineon has developed a novel plug & play insulated molded power package which enables high power density by providing a reliable thermal path from chip to application heatsink. The basic idea is to integrate the function of electrical isolation & thermal grease for heatsink contact into the package. The integrated high thermally conductive and electrically isolating layer simplifies the TO-package assembly process by eliminating costly thermal grease or even thermal interface sheets. This allows for the first time the introduction of isolated TO-package offering products with current ratings up to 120 A. The new package offers a small coupling capacitance and has proven a long-term thermal conductivity & insulation reliability according to industrial standards. It is an excellent product-to-system example lowering system complexity, development time and assembly costs.