High Speed, Thermally Enhanced, Small Footprint SiC Power Modules for Cost Sensitive Applications

Inhalt:
Si-based power module cost reduction is typically achieved by material and/or assembly cost reduction rather than by chip area minimization as exemplified by a new generation of “baseplate-less” power modules. The per-area cost of SiC devices, however, is much higher than their Si counterparts and thus module cost is dominated by semiconductor cost rather than material/assembly costs. These two different cost structures change the way SiC-based modules should be designed and optimized. This paper presents a new design approach which delivers a superior SiC-based module with improved thermal and electrical performance and significant cost reduction when compared to presently available SiC-based baseplate-less modules.