Thermal Calculation Methodology for Lifetime Estimation of Semiconductor Devices in MMC Application
Konferenz: PCIM Europe 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
16.05.2017 - 18.05.2017 in Nürnberg, Deutschland
Tagungsband: PCIM Europe 2017
Seiten: 6Sprache: EnglischTyp: PDF
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Autoren:
Ye, Yijun; Lutz, Josef; Zeng, Guang (Technical University of Chemnitz, Germany)
Alvarez, Rodrigo; Correa, Pablo (Siemens AG, Germany)
Inhalt:
This paper describes different thermal calculation methods and their impact on the lifetime estimation of power electronic devices in Modular Multilevel Converter (MMC) for high voltage DC transmission (HVDC) application. An algorithm based on the Fast Fourier Transform (FFT) is presented, which enables a fast and precise lifetime estimation for up to several hundred devices at the same time. The advantages and limitations of this method are discussed.