Power Electronic Package for Double Sided Cooling Utilizing Tile-Level Assembly

Inhalt:
Double side cooling of high power modules brings huge advantages in thermal management and miniaturization. It's suitable for current semiconductor materials, but more important for the new wide bandgap materials with only small chip sizes and short switching times, which allow only small stray inductances. This paper discusses the advantages of different 3D-buildup concepts in comparison to a standard module and shows a possible assembly strategy with special concern on gate connection. Additional further investigation like hermetic sealing and integration in a FR4-PCB for driving components are discussed.